One Partner. Three Industrial Flash Solutions.
SD cards, microSD cards, and eMMC : Engineered for demanding environments with long-term supply assurance.
UD info Corp. introduced the expansion of its industrial flash storage portfolio with three industrial grade product lines: SD cards, microSD cards, and eMMC. Together, they address the full spectrum of removable and embedded flash storage requirements in industrial automation, transportation, medical, drone technology, and edge computing. All of them are with both 3D TLC and 3D pSLC options.
"Our goal is to be the single partner that covers the entire industrial flash layer. From removable SD and microSD in the field to soldered eMMC inside the device, all with the long-term supply commitment." — Gibson Chen, General Manager, UD info
Three Products Built for Industrial Demands
SD Card : Reliable Data Capture in the Field SDC-09UG Series
Designed for surveillance cameras, data loggers, industrial IoT gateways, and HMI control panels. Available up to 256 GB with optional 3DpSLC mode for write-intensive deployments. Firmware-level customization covers workload-specific write behavior, PID/VID assignment, hardware write protection and secure erase, eliminating the fit-and-function compromises of off-the-shelf consumer cards. Extended-temperature solutions supporting up to 105°C are currently in development.
microSD Card : Compact and Rugged for Embedded Edge Devices USD-08UG Series
Purpose-built for drone payloads, handheld terminals, wearable devices, and space-constrained embedded systems. Supports LBA customization, hardware write protection, and secure erase. The optional 3DpSLC mode and Extended-temperature solutions up to 105°C are also supported.
eMMC : Soldered Flash for SoC-Based Industrial Designs EMC-UF Series
When removable storage is not an option, eMMC delivers. Operating at eMMC 5.1 HS400 with up to 315 MB/s read / 240 MB/s write, it meets the bandwidth requirements of modern industrial application processors. The FBGA153 package (11.5 × 13.0 × 1.0 mm) supports both 3DTLC (64–256 GB) and 3DpSLC (16–32 GB) variants on a single board layout with up to 105°C optional temperature ranges. Advanced features include Command Queuing, Field Firmware Update (FFU), RPMB secure partitioning, and Power Off Notification for data integrity under unexpected power loss.
